btechcorp has invented and patented a process for aligning high density fibers through the thickness of a polymer matrix... up to 20 million fibers per square inch.
High conductivity metallic fibers provide a continuous path through the thickness of the film., thus avoiding the particle-to-particle contact problem of filled adhesives.
TP-3 High Density Anisotropic Conductive Film (ACF) adhesive is currently being qualified for a variety of applications, including display interconnect, replacing wafer bumps and underfill for flip chip packaging, and lead-free solder replacement 
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