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NTP-1 |
btechcorp has invented and patented a process for aligning high density fibers through the thickness of a polymer matrix... up to 20 million fibers per square inch.
High conductivity metallic fibers provide a continuous path through the thickness of the film., thus avoiding the particle-to-particle contact problem of filled adhesives.
NTP-1 Medium Pitch Anisotropic Conductive Film (ACF) adhesive is currently being qualified for a variety of applications, including: plastic solar panel Z-axis interconnect, low cost microwave PCBs, large area lead-free solder, and PET substrate circuit lamination.
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